微波多芯片组件中键合线的参数提取和优化

Parameters Extraction and Optimization of Bondwire in MMCM

摘要:

为解决微波多芯片组件(Microwave Multi-Chip Module,MMCM)中键合互连线的设计问题,采用三维电磁场软件HFSS和电路设计软件Ansoft Designer对键合线的模型进行了仿真分析。根据仿真结果,提取了键合线的等效电路参数。最后建议采用增加线宽的微带线结构结合两到三根键合线,以达到优化设计的目的。

Abstract:

In order to design a bondwire interconnect in Microwave Multi-Chip Module(MMCM),the 3D electromagnetic analysis software HFSS and circuit design software Ansoft Designer are introduced into the simulation analysis of bondwire models.Based on the simulatio