结合电磁带隙结构和磁性材料的PCB电源接地层设计

A power bus structure in PCBs using EBG and magnetic materials

摘要:

在印制电路板的设计中，供电系阻抗谐振所引起的噪声和电磁干扰问题一直是设计人员关注的焦点。已有的研究显示，适当的电磁带隙(EBG)结构可以有效地降低供电系的电磁干扰。本文通过运用基于快速算法和分解元法的计算机仿真,研究供电系EBG结构中采用磁性材料后的阻抗特性。研究表明,在供电系内侧增加磁性材料涂层, 能在原有基础上进一步抑制电磁干扰。

Abstract:

Power bus noise problem and Electromagnetic interference(EMI) problem caused by resonant impedance had become a major concern for Electromagnetic Compatibility(EMC) engineers engaged in Printed Circuit Board(PCB) design. Previous research had shown that proper Electromagnetic Band-Gap(EBG) structure could reduce not only the magnitude of the transfer impedances but also the number of the resonance peaks, thus contributed to the EMI reduction of the power bus. In this paper, we had focused on the EMI problem from the power bus structure using such EBG structures and found that using the magnetic material coating on the power and ground planes could significantly contribute to the EMI reduction.