三明治型微加速度计温度漂移封装胶关系研究

Relationship between temperature drift and adhesive of sandwich type micro-accelerometers

摘要:

为探索三明治微加速度计温度漂移与封装胶的关系，基于有限元分析方法，结合微加速度计伺服反馈工作原理，对温度漂移与封装胶关系展开了研究。研究表明：封装胶厚度、杨氏模量和与封装胶相连的底部玻璃厚度改变均会影响温度漂移，当封装胶厚度从15 μm增加到35 μm时，温度漂移减小约25%；封装胶杨氏模量从4 GPa减小到0.25 GPa时，温度漂移减小约70%；与封装胶相连的底部玻璃厚度从400 μm增大到1 000 μm时，温度漂移减小约37%。并且，通过与实验结果对比，表明封装胶所引起的温度漂移约为实测漂移的1/4~1/3。研究为三明治微加速度计温度漂移与封装胶关系提供了参考。

Abstract:

The relationship between temperature drift and adhesive is investigated, based on the finite element approach and principle of servo feedback sandwich accelerometer, to cope with the temperature drift of sandwich type accelerometer. It is found that the temperature drift is changed with the changes of thickness, Young’s modulus of adhesive and the thickness of glass. When the thickness of adhesive increases from 15 μm to 35 μm, the temperature drift decreases by about 25%. When the modulus of adhesive varies from 4 GPa to 0.25 GPa, the temperature drift decreases by about 25%. When the thickness of glass adjacent to adhesive increases from 400 μm to 1 000 μm, the temperature drift decreases by about 37%. Meanwhile, it is indicated, by the comparison between the experiment data and the drift brought by the adhesive, that the temperature drift induced by the adhesive is about 1/4 to 1/3 of the experiment data. The exploration might be helpful for the understanding of relationship between temperature drift and adhesive of sandwich type micro-accelerometers.