小型化层叠式三维T/R组件

Miniaturization and multilayer for 3-D T/R module

摘要:

三维收发(T/R)组件具有小型化、重量轻和可扩充等特点，成为T/R组件技术的重要发展方向之一。本文对一种基于低温共烧陶瓷(LTCC)的Ku波段小型化三维T/R组件进行了研究，通过分析优化组件的垂直微波互连技术、电路布局优化及无源等效模型，设计出具有优良电性能(输出功率≥24.5 dBm，接收增益大于≥25 dB，接收噪声系数≤3.5 dB)的小型化三维T/R组件。该组件利用LTCC高密度布线、球栅阵列(BGA)高密度连接优点，把组件设计成三层层叠结构，并且把部分芯片集成于“多功能芯片”，进一步缩小了尺寸，单个组件尺寸为9.5 mm×9.5 mm× 3.8 mm，有效实现了T/R组件的小型化。

Abstract:

The characters of the miniaturization，light weight and available extension make the three-dimensional Transmit Receive(T/R) module become one of the important development trends in the T/R module technology field. In this paper, a Ku band T/R module with 3-D structure is studied. First the vertical structure, the circuit layout and passive model are studied; then a miniaturized T/R module is designed, which has excellent electrical performance(Pout≥24.5 dBm，Gr≥25 dB，NF≤3.5 dB). The module is miniaturized by adopting three methods, including designing a three-layer structure, the use of high density Low Temperature Co-fired Ceramic(LTCC)and Ball Grid Array(BGA), and making a multi-chip. The dimension of T/R module is 9.5 mm×9.5 mm×3.8 mm.