一种基于硅基MEMS三维异构集成技术的T/R组件

A T/R module based on silicon-based MEMS 3D integration technology

摘要:

基于硅基微电子机械系统(MEMS)三维异构集成工艺，设计并制作了用于相控阵天线系统的三维堆叠式Ku波段双通道T/R组件。该组件由两层硅基结构通过球栅阵列(BGA)植球堆叠而成，上下两层硅基封装均采用5层硅片通过硅通孔(TSV)、晶圆级键合工艺实现。组件集成了六位数控移相、六位数控衰减、串转并、电源调制、逻辑控制等功能，最终组件尺寸仅为15 mm×8 mm×3.8 mm。测试结果表明，在Ku波段内，该组件发射通道饱和输出功率大于24 dBm，单通道发射增益大于20 dB，接收通道增益大于20 dB，噪声系数小于3.0 dB。该组件性能好，质量轻，体积小，加工精确度高，组装效率高。

Abstract:

A Ku-band dual-channel 3D integrated T/R module for array antenna system is designed and fabricated based on silicon Micro-Electro Mechanical System(MEMS) technology. The module consists of two layers of silicon-based packages stacked by Ball Grid Array(BGA). The upper and lower layers of silicon-based packages are realized by five layers of silicon wafers through Through-Silicon-Via(TSV) and wafer-level bonding. The module integrates the functions such as 6 bit digital control phase shifting, 6 bit digital control attenuation and serial-to-parallel conversion, negative voltage bias, power modulation. The finished module size is only 15 mm×8 mm×3.8 mm. The test results show that in the Ku-band, the saturation output power of the transmitting channel is greater than 24 dBm, the gain of transmitting channel reaches 20 dB, the gain of the receiving channel is greater than 20 dB, and the noise coefficient is less than 3.0 dB. The assembly bears the advantages of high performance, light weight, small volume, high machining precision and high assembly efficiency.