Parameters Extraction and Optimization of Bondwire in MMCM
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Abstract:
In order to design a bondwire interconnect in Microwave Multi-Chip Module(MMCM),the 3D electromagnetic analysis software HFSS and circuit design software Ansoft Designer are introduced into the simulation analysis of bondwire models.Based on the simulatio
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曾耿华,唐高弟.微波多芯片组件中键合线的参数提取和优化[J]. Journal of Terahertz Science and Electronic Information Technology ,2007,5(1):