LIU Cang-li (China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
Associate editor-in-chief
ZHANG Jian (Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
LUO Xue-mei (Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
Members
FANG Guang-you (Institute of Electronics,China Academy of Sciences,Beijing 100190,China)
WANG Hong-qiang (Electronic Science and Engineering,National university of defense technology,Changsha Hunan 410073,China)
WANG Jian-guo (Northwest Institute of Nuclear Technology,Xi'an Shaanxi 710024,China)
WANG Ling (China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
WANG Yue-ke (National University of Defense Technology,Changsha Hunan 410073,China)
WANG Zheng (Institute of High Energy Physics,Chinese Academy of Sciences,Beijing 100049,China)
WANG Zhi-ming (School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China,Chengdu Sichuan 611731,China)
DENG Jian-jun (Institute of Fluid physics,China Academy of Sciences,Beijing 100190,China)
FENG Hua (Third Military Medical University,Chongqing 400038,China)
FENG Jin-jun (The 12th Institute,China Electronics Technology Group Corporation,Beijing 100015,China)
FENG Yu-fang (Institute of the Second Artillery Equipment,Beijing 100085,China)
SHI Sheng-cai (Purple Hills Observatory,China Academy of Sciences,Nanjing 210008,China)
AI Bo (Beijing Jiaotong University,Beijing 100044,China)
LIU Yun (Institute of 212,China North Industries Group Corporation,Xi'an Shaanxi 710065,China)
LIU Jie (Institute of Modern Physics,Chinese Academy of Sciences,Lanzhou Gansu 730000,China)
LIU Rong-ke (Electronic and Information Engineering,Beihang University,Beijing 100191,China)
LIU Xin-yu (Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029; China)
XU Zhou (Institute of Applied Electronics,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
HE Xiao-hai (College of Electronics and Information Engineering,Sichuan University,Chengdu Sichuan 610064,China)
HE Qing-guo (The 13th Institute,China Electronics Technology Group Corporation,Shijiazhuang Hebei 050002,China)
WU Ming-xi (Chinese weapons Science Research Institute,Beijing 100089,China)
SONG Ai-guo (Department of Instrument Science and Engineering,Southeast University,Nanjing Jiangu 210096,China)
ZHANG Zheng-pan (The 58th Institute,China Electronics Technology Group Corporation,Wuxi Jiangsu 214035,China)
ZHANG Wei-li (Department of Electrical and Computer Engineering,Oklahoma State University,Stillwater Ok74078,USA)
ZHANG Cun-lin (Physics Department,Capital Normal University,Beijing 100048,China)
ZHANG Huai-wu (School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China,Chengdu Sichuan 611731,China)
ZHANG Hai-xia (Institute of Microelectronics,Peking University,Beijing 100871,China)
LI Li-ping (School of Electronic Engineering,University of Electronic Science and Technology of China,Chengdu Sichuan 611731,China)
SHU Xiao-jian (Institute of Applied Physics and Computational Mathematics,Beijing 100088,China)
YANG Jian (Department of Electronic Engineering,Tsinghua University,Beijing 100084,China)
WANG Chun-ting (The 54th Institute,China Electronics Technology Group Corporation,Beijing 100070,China)
XIAO Jian (School of Electrical Engineering,Southwest Jiaotong University,Chengdu Sichuan 610031,China)
SHAO Yu-bin (Faculty of Information Engineering and Automation,Kunming University of Science and Technology,Kunming Yunnan 650051,China)
CHEN Hou-jin (School of Electronic Information Engineering,Beijing Jiaotong University,Beijing 100044,China)
CHEN Jia-pin (Research Institute of Micro/nano Science and Technology,Shanghai Jiao Tong University,Shanghai 200030,China)
CHEN Jian (School of Electronic Science and Engineering,Nanjing University,Nanjing Jiangsu 210093,China)
CHEN Hao (China Aerospace Science and Technology Corporation,Xi'an Shaanxi 710061,China)
CHEN De-ying (Harbin Institute of Technology,Harbin Heilongjiang 150080,China)
SHANG Li-ping (School of Information Engineering,Southwest University of Science and Technology,Mianyang Sichuan 621010,China))
LIN Fu-jiang (Department of Electronic Science and Technology,Electronic Science and Technology Department,Hefei Anhui 230027,China)
FAN Wen-hui (Xi 'an Institute of Optics and Precision Mechanics of CAS,Xi 'an Shaanxi 710119,China)
FAN Ning-jun (Beijing Institute of Technology,Beijing 100081,China)
FAN Guo-bin (China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
JIN Lin (The 14th Institute,China Electronics Technology Group Corporation,Nanjing Jiangsu 210039,China)
ZHOU De-yun (School of Electronics and Information,Northwestern Polytechnical University,Xi 'an Shaanxi 710119,China)
YU Jun-sheng (School of Electronic Engineering,Beijing University of Posts and Telecommunications,Beijing 100876,China)
YAO Jun (Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
JIANG Wan-shun (The 41st Institute,China Electronics Technology Group Corporation,Qingdao Shandong 266555,China)
HONG Wei (School of Information Science and Engineering,Southeast University,Nanjing Jiangsu 210096,China)
HU Bo (Electronic Engineering Department of Fudan University,Shanghai 200433,China)
ZHAO Zhi-jin (College of Communication Engineering,Hangzhou Dianzi University,Hangzhou Zhejiang,310018,China)
ZHAO Qiang (Institute of Computer Application,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
TANG Yong-jian (Research Center of Laser Fusion,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
TANG Chuan-xiang (Department of Engineering Physics,Tsinghua University,Beijing 100084,China)
TANG Chao-jing (School of Electronic Science and Engineering,National University of Defense Technology,Changsha Hunan 410073,China)
QIN Hua (Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences,Suzhou Jiangsu 215123,China)
NIE Zai-ping (University of Electronic Science and Technology of China,Chengdu Sichuan 610054,China)
GUO Dong-hui (School of Information Science and Technology,Xiamen University,Xiamen Fujian 361005,China)
GUO Ken-ping (Shanghai Spaceflight TT&C and Telecommunication Institute, Shanghai 200086, China)
GUO Li-li (College of Information and Communication Engineering,Harbin Engineering University,Harbin Heilongjiang,150001,China)
CUI Tie-jun (School of Information Science and Engineering,Southeast University,Nanjing Jiangsu 210096,China)
CHANG Qing (Electronic and Information Engineering,Beihang University,Beijing 100191,China)
CAO Jun-cheng (Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China)
HUANG Ka-ma (College of Electronics and Information Engineering,Sichuan University,Chengdu Sichuan 610064,China)
ZENG Xiao-ping (College of Communication Engineering,Chongqing University,Chongqing 400044,China)
JIAO Li-cheng (School of Electronic Engineering,Xidian University,Xi’an Shaanxi 710071,China)
SHU Yuan-jie (Institute of Chemical Materials,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
DONG Xiao-long (National Space Science Center,Chinese Academy of Sciences,Beijing 100190,China)
XIE Jing-wen (Beijing Institute of Tracking and Telecom Technology,Beijing 100094,China)
HAN Yan (North University of China,Taiyuan Shanxi 030051,China)
XIONG Yong-zhong (Terahertz Research Center,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)
PAN Wei (School of Information Science and Technology,Southwest Jiaotong University,Chengdu Sichuan 610031,China)
PAN Ming (The 50th Institute,China Electronics Technology Group Corporation,Shanghai 200063,China)
LI Qi-sheng (Institute of Systems Engineering,China Academy of Engineering Physics,Mianyang Sichuan 621999,China)